Semiconductor Assembly and Testing Services Industry

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Wafer Dicing The initial phase of semiconductor assembly is wafer dicing. During fabrication, ICs are produced in arrays on silicon wafers that are later separated, or "diced," into discrete chips. Dicing requires precision sawing to cut grooves, or "streets," between each die location on the wafer. Modern dicing saws use diamond-coated blades just microns in width to cut along crystal lattice...

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