Originally published on Technavio:Global Semiconductor Wafer Polishing and Grinding Equipment Market Analysis 2024-2028: APAC, North America, Europe, South America, Middle East and Africa - US, South Korea, Taiwan.

Semiconductor Wafer Polishing and Grinding Equipment Market Forecast 2024-2028  
The semiconductor wafer polishing and grinding equipment market size is anticipated to grow by USD 442.01 million, marking a CAGR of 4.06% between 2023 and 2028. The market's growth hinges on factors such as the rise of miniaturized semiconductor components, increased investments in new fabrication plants, and incentives for long-term customers of end-users.

Market Growth Analysis Driver
The key driver propelling the market is the emergence of miniaturized components. Manufacturers are keen on producing miniaturized personal electronics with lower power consumption. This demand spans a range of semiconductor components, from ICs and chips to LED displays. The surge in demand for miniaturized electronic devices necessitates a focus on reducing device size without compromising performance. IC chips, a vital component, need to be small yet deliver superior performance while minimizing power consumption.

Furthermore, as consumer electronics evolve, there is a growing demand for miniaturized ICs. This trend is expected to drive market development during the forecast period.

Market Growth and Trends  
Transition Toward 3D Structures  
A primary market trend is the shift toward 3D structures. 3D chip architecture enables the stacking of several layers atop each other, compacting the IC. This architectural innovation finds applications in smart devices, photonics, imaging, and advanced logic. The forecast indicates a growth in 3D NAND, driven by increased demand for applications like data center storage, smartphones, and memory cards.

To meet the demand for enhanced integration and form factors, microelectronic device manufacturers are adopting 3D chip stacking. These chips are designed differently, requiring the packaging of chips and interconnects. The utilization of TSV chips presents a lucrative opportunity for wafer polishing and grinding equipment manufacturers, as the creation of TSV chips leaves excess material on the wafer surface. Consequently, these factors are expected to contribute to market expansion during the forecast period.

Market Restrain 
Increased Gap Between Development Times 
A significant challenge hindering market expansion is the increased gap between development times. The cyclical nature of the semiconductor industry, coupled with the difficulty in forecasting IC demand, leads to challenges in tool demand prediction. Semiconductor foundries place orders for tools once they foresee a rise in IC numbers. This reliance on global market players for equipment components poses a challenge. Delays in the supply chain result in tool development delays, affecting the release timelines. This dependency on suppliers may limit market expansion during the forecast period.

Market Segmentation By Application  
The 300 mm segment is poised to hold a substantial market share during the forecast period, driven by extensive usage in memory ICs. Leading memory manufacturers like SAMSUNG, Micron Technology, and SK HYNIX develop memory ICs on 300 mm wafers, making them major users. Foundries such as Taiwan Semiconductor Manufacturing Company, GLOBALFOUNDRIES, United Microelectronics, and SMIC are also focusing on ICs optimized for 300 mm wafers.

End-user Analysis 
Dominance of the Foundries Segment  
The foundries segment is expected to account for the largest market share, with moderate growth driven by developing regions in APAC. Countries like India, Bangladesh, Thailand, and Nepal exhibit high growth potential for electronic devices, compelling OEMs to order more devices. The completion of fab construction will trigger increased demand for devices like memory, logic, discrete, analog, sensor, and opto devices, consequently driving tool demand during the forecast period.  
APAC's Significant Contribution
APAC is estimated to contribute 68% to the global market's growth during the forecast period. The presence of prominent foundries like TSMC, Samsung, and SMIC in APAC generates demand for wafer polishing and grinding equipment. Key countries such as Taiwan, South Korea, Japan, and China, with major manufacturers, significantly contribute to demand. Additionally, dominant players like Samsung, Sony, LG, Toshiba, and Panasonic in the consumer electronics and mobile devices market further support demand in APAC.

Moreover, increasing demand for miniaturized ICs from various end-user industries, driven by technological advancements and growing investments in IoT, automation, and HMI technologies, further boosts demand. Investments in new fabrication plants are expected to drive demand during the forecast period.

Market Customer Landscape 
The market forecasting report encompasses the adoption lifecycle, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. The report includes key purchase criteria and drivers of price sensitivity to aid companies in evaluating and developing market growth and trends strategies.

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Companies employ various strategies, such as alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their market presence.

Axus Technology: The company offers products like Disco DAG810 single axis automatic wafer grinder, Strasbaugh 7AF wafer grinder, and Capstone CS200 series CMP processing.
The market research report forecasts revenue-driven growth at global, regional, and country levels. It provides an analysis of the latest trends and growth opportunities spanning from 2018 to 2028.

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